H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/02 (2006.01) H05K 1/11 (2006.01) H05K 1/14 (2006.01)
Patent
CA 2606057
According to one embodiment, first to fourth pads are arranged on a surface mounting area of a printed circuit board along one side of the mounting area, with a preset gap defined between each pair of adjacent ones of the pads. The first to third pads form a first land, and the second to fourth pads form a second land. When a first three-terminal regulator IC is mounted on the first land, a radiator-side terminal pin incorporated in the regulator IC is connected to a first radiator pad and a common radiator pad. When a second three-terminal regulator IC is mounted on the second land, a radiator-side terminal pin incorporated in the regulator IC is connected to a second radiator pad and the common radiator pad.
Gowling Lafleur Henderson Llp
Kabushiki Kaisha Toshiba
LandOfFree
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