Microencapsulated adhesives

Details Microencapsulated adhesives Microencapsulated adhesives

B - Operations, Transporting

01

J

B01J 13/18 (2006.01) B01J 13/02 (2006.01) C08F 20/18 (2006.01) C09J 9/00 (2006.01) C09J 133/00 (2006.01) C09J 133/06 (2006.01)

Patent

CA 2103091

ABSTRACT OF THE DISCLOSURE A microencapsulated adhesive and a method for producing that microencapsulated adhesive are disclosed. The adhesive is produced from an alkyl acrylate or methacrylate monomer having about 4 to about 12 carbon atoms, or a mixture thereof. The monomer is encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/formaldehyde encapsulation. The microcapsules may be polyamide or polyurea. The monomer is polymerized in the microcapsules by heating to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The micro- encapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.

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