Uv-cured hot-melt adhesive

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 33/00 (2006.01)

Patent

CA 2518619

The inventive composition contains at least one polyacrylate that can be melted and cross-linked using UV light, optional additives and is characterised by an oligomer compound comprising at least one functional group that can be cross-linked using UV, said compound having a viscosity of between 0.1 and 20 Pa.s at 25 ~C. The invention also relates to the use of the composition as a UV cross-linked hot-melt adhesive and to a method for producing a substrate that is provided with the composition. The composition can be used at a lower temperature than previous conventional hot-melt adhesives.

La présente invention concerne une composition qui contient au moins un polyacrylate fusible pouvant réticuler au moyen de lumière UV et éventuellement des additifs. Cette composition est caractérisée par un composé oligomère qui présente au moins un groupe fonctionnel pouvant réticuler au moyen de lumière UV. Ce composé présente une viscosité située entre 0,1 et 20 Pa.s à 25 ·C. La présente invention concerne également l'utilisation de ladite composition en tant que colle fusible pouvant réticuler au moyen de lumière UV, ainsi qu'un procédé pour produire un substrat présentant ladite composition. Cette composition peut s'appliquer à une température inférieure à celle des compositions courantes de la technique antérieure.

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