Process for the manufacture of epoxy compounds

Details Process for the manufacture of epoxy compounds Process for the manufacture of epoxy compounds

C - Chemistry, Metallurgy

07

D

C07D 301/26 (2006.01) C07C 41/18 (2006.01) C07C 41/22 (2006.01) C07D 317/36 (2006.01) C07D 317/38 (2006.01) C08G 59/00 (2006.01) C08G 59/02 (2006.01)

Patent

CA 2279973

Process for the preparation of compound of formula (C) wherein Rc represents a residue comprising one or more additional groups of formula (1) by heating a compound of formula (A) or (B) at a temperature in the range of from 120 to 220 ~C in the presence of hydrogen halide addition salt of tertiary amine; process for the preparation of epoxy compounds starting from the reaction of a polyphenol compound and glycidol; and epoxy resin obtained by this process showing a significantly lower content of intermingled clorine and being substantially free of usual build-up products.

Procédé de préparation d'un composé de formule (C) dans laquelle R¿c? représente un reste comprenant un ou plusieurs groupes additionnels de formule (1). Selon ledit procédé de préparation, on chauffe un composé de formule (A) ou (B) à une température comprise entre 120 et 220 ·C en présence de sel d'addition d'halogénure d'hydrogène d'amine tertiaire. Cette invention concerne également un procédé de préparation de composés d'époxy à partir de la réaction d'un composé de polyphénol et de glycidol; elle concerne également des résines époxy obtenues à l'aide de ce procédé, qui présentent une teneur sensiblement inférieure en chlore enchevêtré et qui sont sensiblement dépourvues des produits d'accumulation habituels.

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