C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 151/06 (2006.01)
Patent
CA 2172386
Hot-melt adhesive compositions useful for packaging are disclosed. These hot-melt adhesive compositions are based on modified polyethylene and contain an ethylene-alkylacrylate copolymer, a polyethylene graft copolymer, a tackifying resin, and a high-melting low viscosity wax. The hot-melt adhesive compositions disclosed have fast setting times and a novel combination of desired properties with good high and low temperature bond strength.
L'invention concerne des compositions de colles thermofusibles utiles dans l'emballage à base de polyéthylène modifié et contenant un copolymère d'éthylène-alkylacrylate, un polymère de polyéthylène greffé, une résine adhésive, et de la paraffine à point de fusion élevé et à faible viscosité. Lesdites compositions adhésives thermofusibles présentent des durées de solidification réduites et une nouvelle combinaison de propriétés désirées dont une bonne résistance d'adhésion à faible et haute températures.
Gowling Lafleur Henderson Llp
H.b. Fuller Company
LandOfFree
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