Printed circuit board and method for fabricating such board

Details Printed circuit board and method for fabricating such board Printed circuit board and method for fabricating such board

H - Electricity

05

K

H05K 1/02 (2006.01) H05K 1/11 (2006.01) H05K 1/14 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2352820

A printed circuit board assembly (10) having a pair of printed circuit boards (12, 14). Each one of the boards (12, 14) has a conductive via (22) passing from a surface of a dielectric (16) into an interior region (17) of the dielectric (16). Each one of the printed circuit boards (12, 14) has a reference potential layer (20) and a signal conductor (18) disposed in the dielectric (16) thereof parallel to, the reference potential layer (20) thereof to provide a transmission line (25) having a predetermined impedance. The signal conductor (18) of each one of the boards is connected to the conductive via (22) thereof. The conductive via (22) in each one of the boards is configured to provide an impedance to the transmission line (25) thereof substantially matched to the impedance of the transmission line (25) thereof. A first electrical connector (32) is provided having a signal contact (36) connected to the conductive via (22) of one (12) of the boards and a second electrical connector (34) having a signal contact (38) connected to the conductive via (22) of the other one (14) of the boards. The first signal contact (36) of the first electrical conductor (32) is adapted for electrical connection to the second contact (38) of the second electrical connector (34).

L'invention concerne un ensemble (10) de cartes imprimées, possédant une paire de cartes imprimées (12, 14). Chaque carte (12, 14) possède un trou d'interconnexion conducteur (22) qui passe d'une surface d'un diélectrique (16) dans une région intérieure (17) dudit diélectrique (16). Chaque carte imprimée (12, 14) possède une couche (20) potentielle de référence, et un conducteur de signal (18) placé dans le diélectrique (16) parallèle à ladite couche (20) potentielle de référence, afin d'obtenir une ligne de transmission (25) présentant une impédance prédéterminée. Le conducteur de signal (18) de chaque carte est relié au trou d'interconnexion (22) conducteur. Le trou d'interconnexion (22) de chaque carte est configuré, de façon à fournir une impédance à la ligne de transmission (25) correspondant sensiblement à l'impédance de la ligne de transmission (25). Un premier connecteur électrique (32) possède un contact de signal (36) relié au trou d'interconnexion (22) conducteur de l'une (12) des cartes, et un second connecteur électrique (34) possède un contact de signal (38) relié au trou d'interconnexion (22) conducteur de l'autre (14) carte. Le premier contact de signal (32) du premier conducteur électrique (32) est conçu pour être relié électriquement au second contact (38) du second connecteur électrique (34).

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