Two-solution acrylic adhesive compound

C - Chemistry – Metallurgy – 08 – L

Patent

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400/3029, 400/49

C08L 53/00 (2006.01) C08L 23/32 (2006.01) C08L 25/08 (2006.01) C08L 25/10 (2006.01) C09J 4/02 (2006.01) C09J 4/06 (2006.01)

Patent

CA 2006868

ABSTRACT A two-solution acrylic adhesive composition, consisting of a solution A, in which the following ingredients [1][3] are dissolved and mixed as nec- essary ingredients, in the proportions mentioned below, and a solution B, in which the following ingredients [4]-[6] are dissolved and mixed as necessary ingredients, in the proportions mentioned below: Solution A (1) Chlorosulfonated polyethylene 12.5-35wt% (2) At least one (meth) acrylate selected from a group consisting of (meth)acrylic acid, (meth)arylate, di(met)acrylate, and (meth)acrylates with hydroxyl, glycidyl, or amino groups 50-85wt% (3) Organic peroxide 0.2-10 wt% Solution B (4) Butadiene-acrylonitrile copolymer elastormer 10-25 wt % (5) At least one (meth) acrylate selected from a group consisting of (meth) acrylic acid, (meth) acrylate, di(meth) acrylate, and (meth) acrylates with hydroxyl, glycidyl, or amino groups 40-90 wt % (6) Curing accelerator consisting of an amine-aldehyde conden- sate 1-20 wt %

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