Multichip integrated circuit module and method of fabrication

Details Multichip integrated circuit module and method of fabrication Multichip integrated circuit module and method of fabrication

H - Electricity

01

L

H01L 23/12 (2006.01) H01L 21/50 (2006.01) H01L 21/56 (2006.01) H01L 21/98 (2006.01) H01L 23/28 (2006.01) H01L 23/538 (2006.01) H01L 25/00 (2006.01) H01L 25/065 (2006.01)

Patent

CA 2106872

2106872 9217901 PCTABS00016 A multichip integrated circuit package comprises a substrate (12) having a flat upper surface to which is affixed one or more integrated circuit chips (14) having interconnection pads (22). A polymer encapsulant (18) completely surrounds the integrated circuit chips (14). The encapsulant is provided with a plurality of via openings therein to accommodate a layer of interconnection metallization (20). The metallization (20) serves to connect various chips (14) and chip pads (22) with the interconnection pads (22) disposed on the chips (14). In specific embodiments, the module is constructed to be repairable, have high I/O capability with optimal heat removal, have optimized speed, be capable of incorporating an assortment of components of various thicknesses and function, and be hermetically sealed with a high I/O count. Specific processing methods for each of the various module features are described herein, along with additional structural enhancements.

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