Mechanical barrier element for improved thermal reliability...

Details Mechanical barrier element for improved thermal reliability... Mechanical barrier element for improved thermal reliability...

H - Electricity

01

L

H01L 23/31 (2006.01) H01L 21/56 (2006.01) H01L 23/34 (2006.01)

Patent

CA 2676495

Embodiments of the invention are generally related to packaging of integrated circuit devices, and more specifically to the placement of thermal paste for cooling an integrated circuit device during operation. A barrier element may be placed along at least one side of an integrated circuit chip. The barrier element may contain thermal paste pumped out during expansion and contraction of the package components to areas near the chip. The barrier element may also form a reservoir to replenish thermal paste that is lost during thermal pumping of the paste.

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