Solderless pin connection

Details Solderless pin connection Solderless pin connection

H - Electricity

05

K

H05K 3/30 (2006.01) H05K 3/40 (2006.01) H01R 12/34 (2006.01) H01R 12/04 (2006.01)

Patent

CA 2302798

A solderless pin connection for a printed circuit board wherein a substrate is printed with polymer thick film. The substrate includes an inner surface defining a hole. The polymer thick film is applied along a top surface of the substrate and along the inner surface. The polymer thick film may additionally be applied along a bottom surface of the substrate with an additional layer along the inner surface. A pin, having a diameter less than a diameter of the hole, is press fit within the polymer thick film along the inner surface the pin. The pin is staked with respect to the substrate using a mechanical connection such as barbs or a folded portion on a staked end of the pin.

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