Semiconductor clamping device

Details Semiconductor clamping device Semiconductor clamping device

H - Electricity

01

L

H01L 23/34 (2006.01) H01L 23/40 (2006.01)

Patent

CA 2273687

The present invention relates to a clamping device for increasing the heat transfer between a semiconductor device and a heat dissipating device. The clamping device comprises a clamp having a pair of cooperating jaws. A resiliently biased pressure distribution member extends from one of the jaws. The pressure distribution member and the other jaw are adapted to hold a semi-conductor device in contact with the heat dissipating device. A tie rod extends between the clamp jaws. A collar is provided having a central cavity for holding the semiconductor device within and aligning the semiconductor device with respect to the heat dissipating device and the clamp. The collar also has a channel for engaging the tie rod and aligning the collar such that the semiconductor device is aligned between the pressure distribution member and the opposite clamp jaw.

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