Method and semifinished product for the production of an inlay

G - Physics – 06 – K

Patent

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G06K 19/077 (2006.01)

Patent

CA 2675660

The invention relates to a method and a semi-finished product (33) for the production of an inlay, particularly for chip cards, prepaid cards, identification documents, or the like, comprising at least two electronic components, wherein all electronic components can be disposed on a carrier substrate (36) in a relative arrangement for configuring a component arrangement (13), and the component arrangement is disposed in a filler material (12). The invention further relates to a method for the production of a card using a semi-finished product, and to a card produced using the semi-finished product.

L'invention concerne un procédé et un demi-produit (33) permettant la production d'un inlay, en particulier pour des cartes à puce, des cartes de valeur, des documents d'identification ou analogues, qui comprend au moins deux composants électroniques, tous les composants électroniques étant placés selon un agencement relatif sur un substrat support (36) pour former un ensemble de composants (13) et l'ensemble de composants étant placé dans un matériau isolant (12). L'invention se rapporte également à un procédé de fabrication d'une carte à l'aide d'un demi-produit ainsi qu'une carte fabriquée à l'aide du demi-produit.

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