Blister package scoring machine

B - Operations – Transporting – 65 – B

Patent

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Details

B65B 61/02 (2006.01) B26D 3/08 (2006.01) B26D 7/06 (2006.01) B26D 7/20 (2006.01) B26D 7/26 (2006.01)

Patent

CA 2225200

In contrast to typical machines though, the present invention discloses a device which allows the plate to "float" within the mechanism, so that any inaccuracies in dimensional tolerances between plate and knife are absorbed in a damping of the plate or bed of the mechanism. In this situation, the depth of the cut of the score line can be very reliably controlled, which results in the repeatable manufacturing of a child resistant, yet senior effective package. There is used a spring pre-load for this plate, which is such that cutting takes place yet, as the tool closes, the plate and package come in "metal to metal" contact, assuring "near perfect" cuts of the blister package. Extremely high tolerances are maintained, assuring packages which pass all levels and types of QA testing .

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