Molded printed circuit board

Details Molded printed circuit board Molded printed circuit board

H - Electricity

05

K

H05K 3/00 (2006.01) H04W 88/02 (2009.01) H01R 12/51 (2011.01) H01R 13/405 (2006.01) H01R 13/50 (2006.01) H01R 13/52 (2006.01) H01R 43/24 (2006.01) H05K 1/11 (2006.01)

Patent

CA 2737926

A molded printed circuit board is taught wherein the printed circuit board can be placed inside of a mold and a material is injected therein. The material hardens in the mold around the printed circuit board thereby forming an overmolded printed circuit board. The overmolded material can have apertures in it to allow access to the leads on the printed circuit board so that components to be connected to it. The overmolded printed circuit boards can allow a plurality of electrical components to selectively and removably attach to it. Further, the printed circuit board may be attached in a housing which can itself removably and selectively connect to components.

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