Improved isolation between diffusion lines in a memory array

H - Electricity – 01 – L

Patent

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Details

H01L 21/8246 (2006.01) H01L 21/762 (2006.01) H01L 21/8247 (2006.01) H01L 27/105 (2006.01)

Patent

CA 2179905

A method of forming a memory device with improved isolation between diffusion lines. Parallel, spaced apart thick oxide strips (201) are grown on a substrate. Next, spaced apart, parallel strips (302) having a polysilicon (302a) and nitride (302b) layer, oriented perpendicular to the first strips (201), are formed. The oxide (201 ) between the second strips is removed, followed by an implantation to form source (402) and drain (401) regions. The nitride layer (302B) on the second strips is removed on those strips between two drain diffusions (401) and an oxidation is performed to form self-aligned thick oxide (602) over the source and drain regions. The strips from which the nitride has been removed are also oxidized, thus providing isolation between adjacent drain lines.

Procédé de formation d'une mémoire présentant une isolation améliorée entre les lignes de diffusion. Des bandes parallèles épaisses séparées d'oxyde (201) sont tout d'abord formées sur un substrat. Puis, des bandes parallèles espacées (302) présentant une couche de polysilicium (302a) et une couche de nitrure (302b) et perpendiculaires aux premières bandes (201) sont également formées. L'oxyde (201) se trouvant entre les deuxième bandes est éliminé, puis on procède à une implantation de manière à former la région source (402) et la région drain (401). La couche de nitrure (302b) se trouvant sur les deuxième bandes est éliminée des bandes se trouvant entre deux régions de diffusion des drains (401), puis on effectue une oxydation de manière à former une couche d'oxyde autoalignée épaisse (602) sur les régions source et drain. Les bandes dont le nitrure a été ôté sont également oxydées, ce qui crée une isolation entre les lignes de drain contiguës.

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