C - Chemistry – Metallurgy – 07 – C
Patent
C - Chemistry, Metallurgy
07
C
260/477.3, 260/4
C07C 69/52 (2006.01) C07D 303/02 (2006.01) C07D 307/54 (2006.01) G03F 7/027 (2006.01) G03F 7/038 (2006.01)
Patent
CA 1057763
ABSTRACT OF THE DISCLOSURE The products, which are based on polyepoxides, polymerise on exposure to actinic radiation and are useful in the preparation of printing plates for offset printing and of printed circuits, particularly multilayer circuits. They are formed by coupling two molecules of a polyepoxide by means of a dihydric phenol which contains a chalcone or chalcone-like grouping, such as 1,3-bis(p-phdroxyphenyl)p?op-1-en-3-one or 1,5-bis(p-hydroxyphenyl)penta-1 4-dien-3-one, so sensitising the material to the radiation, and then, to achieve polymerisability, ring-opening at least some of the residual epoxide groups so as to incorp?rate olefinic acyloxy groups (R6CH-C(R5)COO-), such as sorboyl groups.
220486
Green George E.
Losert Ewald
Ag Ciba-Geigy
Na
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