Coated metal band as semi-finished goods for electrical...

H - Electricity – 01 – H

Patent

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Details

IPC codes

H01H 1/02 (2006.01) B23K 35/02 (2006.01) H01H 11/04 (2006.01) H01R 13/03 (2006.01) H01R 43/02 (2006.01)

Type

Patent

Patent number

CA 2124423

Description

ABSTRACT OF THE DISCLOSURE A metal band feedstock for producing contact pieces, the metal band forming a contact profile composed of a backing of hard solder material and of at least one contact layer that is applied onto the backing by electroplating. A contact profile that can be directly welded onto the contact carrier without special welding aids being required is thus produced with optimally few layers. The welding of a contact piece having the profile structure of the invention can be accomplished with a laser beam that is directed onto the hard solder backing of the contact piece through the contact carrier proceeding from the back side.

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