H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/00 (2006.01) H05K 3/28 (2006.01) H05K 3/10 (2006.01) H05K 3/12 (2006.01) H05K 3/22 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2335501
The invention relates to a method for coating both sides of substrates, especially printed circuit boards. One side of a substrate provided with bores is coated using a coating technique, especially screen-printing, in such a way that those bores that are not required for establishing the connections are permanently covered and those that are required are only slightly covered or left uncovered. The other side of the substrate is coated using a coating technique, especially curtain coating or spraying, in such a way that the entire surface of the substrate is provided with an even layer, resulting in a light coating of the bores.
L'invention concerne un procédé permettant de recouvrir les deux faces de substrats, notamment de cartes de circuits, selon lequel une face du substrat muni de perforations est pourvue d'un revêtement, à l'aide un procédé de recouvrement, de manière que les perforations qui ne sont pas nécessaires pour établir la conduction soient recouvertes en permanence et que les perforations requises ne soient que légèrement recouvertes ou soient laissées libres. L'autre face du substrat est ensuite munie d'un revêtement, à l'aide d'un procédé de recouvrement, par exemple par coulage à rideau fondu ou par pulvérisation, de manière que toute la surface du substrat soit munie d'une couche homogène qui ne forme qu'un revêtement léger sur les perforations.
Leibrock Dietmar
Wolfer Klaus
Fetherstonhaugh & Co.
Vantico Ag
LandOfFree
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