C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/10 (2006.01) C08G 59/36 (2006.01) C08L 63/00 (2006.01) C09D 5/44 (2006.01) C09D 163/00 (2006.01) C25D 13/00 (2006.01) H01B 1/20 (2006.01) H01B 1/22 (2006.01) H01B 1/24 (2006.01)
Patent
CA 2404979
A conductive resin composition includes between 40 and 140 parts by weight of reactive epoxy resin, between 15 and 40 parts by weight of a reactive monofunctional glycidyl material, a cure accelerant, and 40 to 240 parts by weight of a conductive particulate material. The conductive resin composition forms a defect-free conductive coating on a substrate after mixing a one part epoxy resin composition under vacuum at a temperature insufficient to induce thermal cure. Adding a liquid epoxy resin to the one part epoxy resin composition to form a mixture combining 40 to 200 parts by weight of conductive particulate with the mixture and dispersing the combined conductive particulate and the mixture under vacuum until a homogeneous conductive resin paste results where the dispersing time for the combined conductive particulate and the mixture under vacuum is greater than or equal to the period of time of vacuum mixing the liquid one part epoxy composition.
Midwest Thermal Spray
Ridout & Maybee Llp
LandOfFree
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