Process for the manufacture of printed circuits using...

Details Process for the manufacture of printed circuits using... Process for the manufacture of printed circuits using...

H - Electricity

05

K

H05K 3/02 (2006.01) C25D 13/20 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01) H05K 3/06 (2006.01)

Patent

CA 2067709

Copper surfaces upon which organic resins are electrophoretically deposited to serve as, e.g., plating or etch resists in the course of manufacturing printed circuits, are preliminarily provided with a uniformizing/ passivating coating layer, such as a layer of copper oxide or phosphate conversion coating, over which the organic resin is electrophoretically deposited, resulting in the organic resin being deposited with substantial uniformity in thickness and properties.

Les surfaces de cuivre sur lesquelles on dépose des résines organiques par électrophorèse, par exemple, pour servir d'agent de protection pour le placage ou la gravure au cours de la fabrication des circuits imprimés, sont d'abord recouvertes d'une couche de revêtement uniformisante-passivante, comme une couche de revêtement de conversion d'oxyde ou de phosphate de cuivre, sur laquelle on dépose la résine organique par électrophorèse; il en résulte un dépôt de résine organique qui se caractérise par une épaisseur et des propriétés substantiellement uniformes.

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