Hexagonal microelectronic integrated circuit chip

Details Hexagonal microelectronic integrated circuit chip Hexagonal microelectronic integrated circuit chip

H - Electricity

01

L

H01L 27/00 (2006.01) H01L 29/06 (2006.01)

Patent

CA 2308133

A microelectronic integrated circuit chip comprises a hexagonal semiconductor die, a plurality of logic circuitries formed at the interior region of the semiconductor die, a plurality of drive circuitries formed at the peripheral region of the semiconductor die, a plurality of input/output bonding pads formed adjacent to the drive circuitries, and a network of electrical conductors arranged on a plurality of interconnect layers. The logic circuitries and the drive circuitries have boundaries and contacts generally angled at a multiple of pi/3 radian (60 degrees), and the electrical conductors on one interconnect layer are generally angled to the electrical conductors on another interconnect layer at a multiple of pi/3 radian (60 degrees), in order to provide high interconnect density and flexible routing. This invention relates to microelectronic integrated circuit chips, and the principal use of the invention is for producing efficient microelectronic integrated circuits.

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