High-g mounting arrangement for electronic chip carrier

Details High-g mounting arrangement for electronic chip carrier High-g mounting arrangement for electronic chip carrier

H - Electricity

05

K

H05K 3/30 (2006.01) H01L 21/58 (2006.01)

Patent

CA 2434150

A chip carrier (20) is coupled to a printed circuit board (22) by leads (24) so that the chip carrier (20) stands off from the printed circuit board (22). A spacer (26) is provided between the chip carrier (20) and the printed circuit board (22). The spacer (26) reduces g forces on the leads(24).

Un porte-puce est couplé à une carte de circuit imprimé par des pattes de connexion de sorte que le porte-puce soit disposé verticalement à distance de la carte de circuit imprimé. Un écarteur est disposé entre le porte-puce et la carte de circuit imprimé. Cet écarteur réduit les forces g sur les pattes de connexion.

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