Polishing slurry

C - Chemistry – Metallurgy – 09 – G

Patent

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Details

C09G 1/02 (2006.01) B24B 1/00 (2006.01) C09K 3/14 (2006.01) G11B 5/84 (2006.01)

Patent

CA 2307154

The invention provides a mixture for polishing surfaces. The mixture includes polishing particles having an average size of less than 10 µm and water. It also includes an accelerator for chemically attacking a surface and a starch for reducing vibration of polishing machines.

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