Hot melt adhesive compositions comprising low molecular...

Details Hot melt adhesive compositions comprising low molecular... Hot melt adhesive compositions comprising low molecular...

C - Chemistry, Metallurgy

09

J

C09J 173/00 (2006.01) C09J 123/08 (2006.01) C08L 91/06 (2006.01) C08L 101/00 (2006.01)

Patent

CA 2129516

2129516 9318108 PCTABS00025 Hot melt adhesive compositions which include a base polymer constituent, a tackifying constituent, a wax constituent, and which further includes a low molecular weight polyethylene copolymer constituent which includes ketone functional moieties and/or hydroxyl functional moieties wherein the hot melt adhesive composition may be further characterized as providing improved adhesive strength to polar and non-polar substrates.

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