C - Chemistry – Metallurgy – 23 – D
Patent
C - Chemistry, Metallurgy
23
D
C23D 3/00 (2006.01) C09J 5/02 (2006.01) C09J 101/00 (2006.01) C23C 22/40 (2006.01) C23C 22/52 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2420540
A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a benzotriazole with an electron withdrawing group in the 1-position which electron withdrawing group is a stronger electron withdrawer than a hydrogen group, and optionally, a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing in order to increase the adhesion of polymeric materials to the metal surface.
L'invention concerne un procédé de traitement de surfaces métalliques avec une composition comprenant un oxydant, un acide, un inhibiteur de corrosion, un benzotriazole ayant un groupe suppresseur d'électrons en position 1 (lequel groupe est plus puissant qu'un groupe hydrogène), éventuellement une source améliorant l'adhérence sélectionné dans le groupe constitué par molybdates, tungstates, tantalates, niobates, vanadates, acides isopoly ou hétéropoly de molybdène, tungstène, tantale, niobium, vanadium, ou leurs combinaisons quelconques, ledit traitement pouvant augmenter l'adhérence de polymères à la surface métallique.
Gowling Lafleur Henderson Llp
Macdermid Incorporated
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