B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 1/20 (2006.01) B23K 1/008 (2006.01) B23K 3/08 (2006.01) F27B 9/14 (2006.01) F27D 1/18 (2006.01)
Patent
CA 2650508
The invention relates to a method and a device (10) for the heat treatment of workpieces (19) or components, especially for producing a soldered connection between a solder material and at least one component or workpiece used as a solder material carrier by melting the solder material arranged on the solder material carrier. According to the invention, the heating and subsequent cooling of at least one component is carried out in a process chamber (13, 14) sealed from the outer surroundings. The component (19) is heated and cooled in two regions (13, 14) of the process chamber (12), which can be separated from each other by a condensation device (15).
L'invention concerne un procédé et un dispositif (10) utilisés dans le traitement thermique de pièces à usiner (19) ou de composants, en particulier dans la production d'une jonction par soudure entre un matériau d'apport et au moins un composant ou une pièce servant de support au matériau d'apport, comprenant la fusion du matériau d'apport disposé sur le support. Selon l'invention, au moins un composant est chauffé et refroidi, dans une étape ultérieure du processus, dans une chambre de traitement (13, 14) isolée de l'environnement, le chauffage et le refroidissement dudit composant (19) étant réalisés dans deux parties (13, 14) de la chambre de traitement (12) séparées l'une de l'autre par un dispositif de condensation (15).
Norton Rose Or S.e.n.c.r.l.,s.r.l./llp
Pink Gmbh Thermosysteme
Pink Gmbh Vakuumtechnik
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