Planar magnetron sputtering apparatus

Details Planar magnetron sputtering apparatus Planar magnetron sputtering apparatus

H - Electricity

01

J

H01J 25/50 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2125532

ABSTRACT PLANAR MAGNETRON SPUTTERING APPARATUS A planar magnetron sputtering device with improved target utilization and cooling capacity is provided. The device includes a magnet yoke as the main structure of the cathode body. The magnet yoke is made of low carbon steel which provides magnetic shunt and physical strength. The target is attached to a metal backing plate so that the side surface of the target is substantially flush with the side surface of the backing plate. Suitable magnets are adapted for producing a closed-loop magnetic field over the lower surface of the target. The magnets include an outer magnet that has an annular structure positioned around an inner elongated magnet. The outer magnets are positioned along the perimeter of the backing plate and small magnets are employed to create larger active target area. The magnet yoke also comprises extension structures which are positioned along the side surface of the target. These extensions shunt the magnetic field at the edges of the target. The planar magnetron demonstrates improved target utilization and deposits more uniform films.

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