Moisture-curable compositions containing polyisocyanates and...

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 18/80 (2006.01) C08G 18/28 (2006.01) C08G 18/30 (2006.01) C08G 18/61 (2006.01) C08G 18/62 (2006.01) C08G 18/71 (2006.01) C08G 18/79 (2006.01) C09D 175/16 (2006.01) C09J 175/16 (2006.01)

Patent

CA 2303698

The present invention relates to moisture-curable compositions containing a mixture of a) a polyisocyanate and b) a polyacrylate resin which has an alkoxysilane group content (calculated as Si, MW 28) of 0.2 to 4.5% by weight, based on the weight of the polyacrylate resin, and contains less than 0.2% by weight of hydroxy groups, based on the weight of the polyacrylate resin, wherein components a) and b) are present in amounts sufficient to provide an equivalent ratio of isocyanate groups to alkoxy groups, which are bound to Si, of 1.0:0.05 to 1.0:2.5. The present invention also relates to coatings, sealants and adhesives prepared from these compositions.

La présente invention concerne des compositions réticulables par l'humidité contenant un mélange a) d'un polyisocyanate et b) d'une résine de polyacrylate ayant un groupe d'alcoxysilane (calculé en tant que Si, Mw 28) de 0,2 à 4,5 % en poids, selon le poids de la résine de polyacrylate, et contenant moins de 0,2 % en poids de groupes hydroxy, selon le poids de la résine de polyacrylate, les composants a) et b) étant présents en quantités suffisantes pour fournir un rapport d'équivalents en groupes isocyanates sur équivalents en groupes alcoxy, qui sont liés à Si, de 1,0:0,05 à 1,0:2,5. La présente invention concerne également des revêtements, des matériaux d'étanchéité et des adhésifs préparés à partir de ces compositions.

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