C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 3/22 (2006.01) C08G 59/62 (2006.01) C08K 3/24 (2006.01) C08K 5/49 (2006.01) C08L 25/04 (2006.01) C08L 63/00 (2006.01) H01B 3/40 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01)
Patent
CA 2449052
Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits. The flame retardant molding compositions include an epoxy resin; a first transition metal oxide containing a refractory metal, such as tungsten trioxide; and a second transition metal oxide containing an oxyanion of a Group VIA element and a cation of a Group IIA element, such as calcium molybdate.
L'invention concerne des compositions de moulage ignifuges sensiblement libres d'halogène, de phosphore et d'antimoine. Elle concerne également l'utilisation de ces compositions dans le revêtement de dispositifs électroniques tels que des circuits intégrés. Lesdites compositions comportent notamment de la résine époxyde; un premier oxyde métallique de transition renfermant un métal réfractaire tel que le trioxyde de tungstène, et un second oxyde métallique de transition renfermant un oxyanion d'un élément du Groupe VIA et un cation d'un élément du Groupe IIA, tel que le molybdate de calcium.
Gallo Anthony A.
Henkel Loctite Corporation
Kirby Eades Gale Baker
LandOfFree
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