Thermal insulation compositions containing organic solvent...

C - Chemistry – Metallurgy – 09 – K

Patent

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Details

C09K 8/592 (2006.01) E21B 36/00 (2006.01) F16L 59/14 (2006.01) F28F 13/00 (2006.01)

Patent

CA 2651156

A thermal insulating packer fluid contains an organic solvent of low thermal conductivity and a gelling agent which is hydratable in the solvent. The composition is capable of inhibiting unwanted heat loss from production tubing or uncontrolled heat transfer to outer annuli. The viscosity of the composition is sufficient to reduce the convection flow velocity within the annulus.

L'invention concerne un fluide de garniture d'étanchéité isolant thermique contenant un solvant organique de faible conductivité thermique et un gélifiant qui est hydratable dans le solvant. La composition est capable d'inhiber des pertes thermiques indésirables de tuyauteries de production ou des transferts thermiques non contrôlés vers les parties annulaires externes. La viscosité de la composition est suffisante pour réduire la vitesse du courant de convection dans l'espace annulaire.

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