High power radiation emitter device and heat dissipating...

H - Electricity – 05 – B

Patent

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Details

H05B 33/02 (2006.01) H01L 23/42 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2432286

The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; and at least one electrical conductor electrically coupled to the electronic component and extending out of the sealed chamber. The electronic component(s) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.

La présente invention concerne un boîtier (10) pour composants électroniques qui comprend : une chambre scellée ; un liquide ou un gel (20) contenu dans ladite chambre ; au moins un composant électronique (12) placé dans la chambre scellée en contact physique ou thermique avec le liquide ou le gel (20) ; et au moins un conducteur électrique couplé électriquement au composant électronique et s'étendant en dehors de la chambre scellée. Le ou les composants électroniques peuvent comprendre un émetteur de rayonnements, un capteur thermique ou optique, une résistance, un microprocesseur et/ou un autre composant à semiconducteur ou une quelconque combinaison de ces derniers.

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