Trace-pad interface for improved signal quality

Details Trace-pad interface for improved signal quality Trace-pad interface for improved signal quality

H - Electricity

05

K

H05K 1/02 (2006.01) H05K 1/11 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2218575

A method of routing or laying out signal traces on printed wire or circuit board in order to improve signal transmission quality. The method comprises routing a given signal trace such that it is electrically connected to a rectangular corner of a substantially wider component pin pad and forms an angle of approximately 135 degrees with the proximate sides of the pad, thereby minimizing the impedance discontinuity at the interface or junction of the signal trace and pad and hence minimizing the reflection of the digital signal at the interface or junction.

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