Coating apparatus and method

Details Coating apparatus and method Coating apparatus and method

C - Chemistry, Metallurgy

23

C

C23C 14/35 (2006.01) H01M 8/02 (2006.01)

Patent

CA 2660085

The invention relates to the provision of apparatus and a method which can be used to allow the sputter deposition of material onto at least one article to form a coating on the same. The new form of magnetron described herein allows an increase in sputter deposition rates to be achieved at higher powers and without causing damage to the coating is created. This can be achieved by improved cooling and use of a relatively high magnetic field in the magnetron while at the same time increasing the power to the magnetron by increasing the current at a rate faster than the voltage.

L'invention porte sur un appareil et le procédé associé permettant des dépôts par pulvérisation cathodique sur au moins un article pour y former un revêtement. La nouvelle forme de magnétron de l'invention accroît la vitesse de dépôt pour des puissances élevées et sans endommager le revêtement ainsi créé. Cela s'obtient par un meilleur refroidissement, l'utilisation d'un champ magnétique relativement élevé dans le magnétron,et une élévation de la puissance du magnétron en faisant croître l'intensité plus vite que la tension.

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