Patterned array of uniform metal microbeads

H - Electricity – 01 – L

Patent

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Details

H01L 21/64 (2006.01) B23K 35/02 (2006.01) C09J 9/02 (2006.01) H01L 21/48 (2006.01) H01L 21/60 (2006.01) H01L 23/498 (2006.01) H01L 23/50 (2006.01) H05K 3/32 (2006.01) H05K 3/10 (2006.01)

Patent

CA 2171190

The present invention provides a method for providing an array of metal microbeads on a substrate, preferably in a regular pattern of very fine, uniform size microspheres or microbeads at precise spacing or scale previously unachievable. The method of the present invention comprises the steps of providing a metal layer (14) on a substrate (12) that is partitioned into metal regions (20); heating the metal layer to a temperature sufficient to melt the metal and to permit beading of the layer into discrete microbeads (22).

L'invention se rapporte à un procédé permettant d'obtenir une matrice de microbilles métalliques sur un substrat, de préférence suivant une disposition régulière des microsphères ou des microbilles de dimension uniforme et très fines, avec un espacement ou à une échelle qu'il était impossible auparavant d'obtenir. Le procédé de l'invention comprend les étapes consistant à déposer une couche métallique (14) sur un substrat (12) divisé en régions métalliques (20), et à chauffer la couche métallique à une température suffisante pour faire fondre le métal et permettre la formation de microbilles discrètes (22) dans la couche.

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