Method for making thick film/solder joints

Details Method for making thick film/solder joints Method for making thick film/solder joints

H - Electricity

05

K

H05K 3/34 (2006.01) H01L 21/48 (2006.01) H05K 3/24 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2076421

EL ?87 TITLE Method for Making Thick Film/Solder Joints Abstract A method for making a thick film/solder joint comprising the sequential steps of: (1) applying a layer of first thick film conductor paste to an electrically non-conductive substrate in a pattern which has preselected solder pad areas and firing the layer; (2) applying over the first thick film layer only within the solder pad area a layer of a second thick film conductor paste having a low frit content and firing the layer; and (3) forming the solder joint by applying to the fired second thick film layer a layer of soft solder.

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