Electronic-circuit assembly and manufacturing method thereof

Details Electronic-circuit assembly and manufacturing method thereof Electronic-circuit assembly and manufacturing method thereof

H - Electricity

05

K

H05K 7/00 (2006.01) H01L 23/498 (2006.01) H05K 3/36 (2006.01) H05K 7/08 (2006.01) H05K 13/00 (2006.01) H05K 13/04 (2006.01) H05K 3/00 (2006.01) H05K 3/30 (2006.01) H05K 3/32 (2006.01) H05K 3/34 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2233385

An electronic-circuit assembly according to the present invention comprises a first substrate on the upper surface of which a plurality of electrodes are provided. A second substrate is placed on the first substrate. The second substrate comprises a plurality of through-holes on the positions opposing to the plurality of terminals on the first substrate, respectively. The plurality of terminals on the first substrate are connected to the plurality of through-holes on the second substrate via a plurality of connecting members, respectively. A plate is placed on the upper surface of the second substrate. A plurality of pins which are provided on the under surface of the plate are inserted into the plurality of through-holes on the second substrate, respectively.

Ensemble de circuit électronique constitué d'un premier substrat dont la surface supérieure présente un certain nombre d'électrodes. Un deuxième substrat, reposant sur le premier, offre une série de trous de passage situés en face de la série de terminaux du premier substrat. La série de bornes du premier substrat est reliée à la série de trous traversants du deuxième substrat par des éléments de connexion. Une plaque se trouvant sur la surface supérieure du deuxième substrat présente un certain nombre de broches sur sa surface inférieure, broches qui sont insérées dans la série de trous de passage du deuxième substrat.

Affiliated with

Also associated with

Rating

Electronic-circuit assembly and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic-circuit assembly and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic-circuit assembly and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1811636