Method of manufacture of electronic or functional devices

H - Electricity – 01 – L

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H01L 21/68 (2006.01)

Patent

CA 2571544

Plastics or other electronic devices are formed on a flexible substrate using inkjet printing techniques. To avoid registration difficulties arising from distortion of the substrate, deposition is conducted on a rigid substrate to which a release layer is applied. After application of a type layer which serves as the permanent, flexible substrate, the structure is released from the temporary rigid substrate.

Des dispositifs en matière plastique ou autres dispositifs électroniques sont formés sur un substrat souple au moyen de techniques d'impression à jet d'encre. Pour éviter les difficultés d'alignement résultant de la distorsion du substrat, le dépôt est réalisé sur un substrat rigide sur lequel est appliquée une couche antiadhésive. Après application d'une couche type qui sert de substrat permanent souple, la structure est séparée du substrat temporaire rigide.

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