Method and apparatus for providing electrical access to...

Details Method and apparatus for providing electrical access to... Method and apparatus for providing electrical access to...

H - Electricity

05

K

H05K 1/18 (2006.01) H01L 21/66 (2006.01) H01L 23/58 (2006.01) H01L 25/065 (2006.01) H05K 3/30 (2006.01)

Patent

CA 2121960

21 METHOD AND APPARATUS FOR PROVIDING ELECTRICAL ACCESS TO DEVICES IN A MULTI-CHIP MODULE ABSTRACT OF THE DISCLOSURE Multi-chip module (MCM) (10) includes package body (12) having cavity (20) for accepting a plurality of devices and substrates and seal ring (26) to ensure the integrity of the package. Lead frame (18) having a plurality of individual leads (28) is coupled to the package body (12). Plurality of test points (38) or test pins (30) are located on the external surface of package body (12). A plurality of bond pads are located in cavity (20), including a first set or tier and a second set or tier of bond pads for electrically coupling the devices and substrates in the cavity (20) external to package body (12). The first set or tier of bond pads provides electrical connection between the individual devices in MCM (10) to plurality of test points (38) or test pins (30), and the second set or tier of bond pads provides electrical connection between the individual devices in MCM (10) and plurality of individual leads (28).

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