C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
400/5919
C09D 163/02 (2006.01) C08G 81/00 (2006.01) C09D 191/00 (2006.01)
Patent
CA 2015589
ABSTRACT Disclosed is a polyamide epoxy ester resin having a weight average molecular weight of 1,000 to 100,000, an epoxy equivalent of 500 to 10,000, and an acid value of not greater than 10, which is prepared by reacting (i) at least one epoxy resin which is a glycidyl ether of a dihydric phenol, (ii) at least one dihydric phenol and (iii) a polyamide dicarboxylic acid having an amine value of not greater than 20 and an acid value of at least 20, which is prepared by reacting a polymerized fatty acid composed mainly of a dimer acid with a diamine at a polymerized fatty acid/diamine molar ratio of from 2/1.0 to 2/1.9, 37,857-F at a ratio of such that the amount of the polyamide dicarboxylic acid segment in the resin ranges 1 to 30 percent by weight based on the weight of the resin. Also, disclosed are a process for preparing the polyamide epoxy ester resin and a coating composition comprising the resin. The coating composition is particularly useful for can coating. 37,857-F
Ohba Kaoru
Smart & Biggar
The Dow Chemical Company
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