Heat-curing, one-component adhesives which are based on...

Details Heat-curing, one-component adhesives which are based on... Heat-curing, one-component adhesives which are based on...

C - Chemistry, Metallurgy

08

G

C08G 18/79 (2006.01) C08G 18/58 (2006.01) C09J 5/06 (2006.01) C09J 175/04 (2006.01)

Patent

CA 2210212

Disclosed is a heat-curing one-component composition comprising A) as a hardener component, a polyaddition product containing hydroxyl and uretdione groups, B) as a binder component, a 1,2-epoxide compound having more than one 1,2-epoxide group and one or more hydroxyl groups in the molecule, and optionally C) a further hydroxyl-containing compound. The composition is useful as an adhesive for a heat-resistant substrate and does not give off elimination products.

Affiliated with

Also associated with

Rating

Heat-curing, one-component adhesives which are based on... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-curing, one-component adhesives which are based on..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-curing, one-component adhesives which are based on... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1834648