Solder connection testing between electronic components and...

G - Physics – 01 – R

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G01R 31/04 (2006.01)

Patent

CA 2199900

A printed circuit board or other substrate with terminal positions for mounting an electronic component on the substrate. At each terminal position, a pair of terminals is provided upon the substrate. With the electrical component soldered in position, a terminal of the component bridges across and electrically interconnects the terminals of the pair at each terminal position. With this arrangement, the solder connection to the electronic component may be tested by connecting a first test location to or source of electrical power, the first test location electrically connected to one of a pair of terminals and determining from a second test location whether current is passing between the terminals of the pair. The second test location is electrically connected to the other terminal of the terminal pair.

Carte de circuits imprimés ou autre substrat comportant des zones de branchement pour fixer un composant électronique sur le substrat. Dans chaque zone de branchement, on trouve une paire de bornes sur le substrat. Une fois le composant électrique soudé en position, une borne du composant établit un pont et relie électriquement les bornes de la paire à chaque zone de branchement. Cette disposition permet de mesurer la connexion soudée du composant électronique en reliant un premier point de mesure, ou une source d'alimentation électrique, au premier point de mesure relié électriquement à une des bornes formant une paire et de déterminer au moyen d'un deuxième point de mesure si le courant passe entre les bornes de la paire. Le deuxième point de mesure est relié électriquement à l'autre borne de la paire.

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