Electroplating solution for electroplating lead and lead/tin...

C - Chemistry – Metallurgy – 25 – D

Patent

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C25D 3/32 (2006.01) C25D 3/36 (2006.01) C25D 3/60 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2296900

An electroplating solution for plating bright tin, lead, or tin-lead alloy solder coatings in high speed electroplating applications. The electroplating solution includes an alkane or alkanol sulfonic acid electrolyte, a non-ionic surfactant, a grain refiner and two brightening agents: an aromatic aldehyde and a carboxylic acid. In one embodiment of the electroplating solution, the sulfonic acid electrolyte is methane sulfonic acid, the non-ionic surfactant is octylphenoxy(10)polyethoxy ethanol, the grain refiner is phenolphthalein, the aromatic aldehyde is chlorobenzaldehyde, and the carboxylic acid is methacrylic acid.

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