H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/42 (2006.01)
Patent
CA 2177708
A method is provided herein for making a printed circuit board. The method includes the first step of forming conduc- tive circuit elements on two opposed faces of a paper phenolic-containing substrate. The substrate and the conductive circuit elements are then coated with a desensi- tising material. Holes are formed through the substrate, each hole passing through a circuit element on each of the opposed faces of the board. The board is then treated to render the substrate which is exposed in the holes receptive to the action of a metallic plating solution. The de-sensitising material is then removed. An acid-resist mask is presented onto both faces of the board, the mask leaving exposed only a small area of the board surrounding each hole therethrough. Finally, the board is treated with an electroless nickel- plating solution to deposit nickel in the holes to the desired thickness to provide an electrical connection through each hole between two opposed conductive circuit elements.
Un procédé de fabrication d'une carte de circuits imprimés à trous métallisés consiste à: a) former des éléments de circuits conducteurs (10) sur deux faces opposées d'un substrat (11) contenant des matériaux phénoliques et du papier laminé; b) à revêtir le substrat et les éléments du circuit avec un matériau de désensibilisation (12); c) former des trous (13) dans le substrat, chaque trou traversant un élément de circuit sur chacune des faces opposées de la carte; d) traiter la carte afin de mettre à nu le substrat dans les trous réceptifs à l'action d'une solution de placage métallique; e) retirer le matériau de désensibilisation; f) imprimer un masque résistant aux acides (14) sur les deux faces de la carte, le masque laissant à nu uniquement une petite surface de la carte entourant chaque trou; et g) traiter la carte avec une solution de nickelage sans électrodes afin de déposer le nickel (15) dans les trous jusqu'à l'épaisseur désirée afin d'obtenir une connexion électrique dans chaque trou situé entre deux éléments de circuits conducteurs, opposés.
Borden Ladner Gervais Llp
Knopp John Frederick David
Macdermid Incorporated
LandOfFree
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