Core for electrical connecting substrates and electrical...

H - Electricity – 05 – K

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H05K 1/02 (2006.01) H05K 1/00 (2006.01) H05K 3/06 (2006.01) H05K 3/40 (2006.01) H05K 3/46 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2120075

ABSTRACT The inventive core for electrical connecting substrates, particularly for printed circuit boards and foil circuit boards, has an inner layer (I) with a columnar structure and on either side, metallic cover layers (A,A'), the columnar structure of the inner layer (I) comprising columns (9.1,9.2), which are regularly arranged, spaced from one another and from the cover layers (A,A'), being directed transversely to the service extension of the core and made from an electrically conductive material in a matrix (6) of an electric- ally insulating material. The cover layers (A,A') e.g. have electri- cal terminals (16,16',17,17') in the form of through-plated blind holes (13,14) on selected columns (9) of the inner layer (I) and are structured in such a way that they have a regular pattern of terminals (16,16') on the facing cover layer and terminals (17,17') on the through-connections insulated from the cover layers, this grid pattern can have a size of approximately 0.5 mm.

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