Method and apparatus for predicting the time to failure of...

Details Method and apparatus for predicting the time to failure of... Method and apparatus for predicting the time to failure of...

G - Physics

01

R

G01R 31/28 (2006.01) G06F 19/00 (2006.01)

Patent

CA 2457734

A method and apparatus are disclosed for determining a time to failure for an electronic device. The method and apparatus includes estimating a dependency of a bond strength degradation rate on at least one parameter and estimating a temperature profile of the electronic device. Furthermore, the method and apparatus determine a bond strength based on the dependency of the bond strength degradation rate and the temperature profile, and determine the time to failure for the electronic device based on a time evolution of the bond strength.

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