Polyimide multilayer wiring board and method of producing same

Details Polyimide multilayer wiring board and method of producing same Polyimide multilayer wiring board and method of producing same

H - Electricity

05

K

H05K 1/00 (2006.01) H01L 21/48 (2006.01) H01L 21/68 (2006.01) H01L 23/538 (2006.01) H05K 3/46 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01) H05K 3/32 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2059020

A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.

Un tableau de connexions multicouche en polyimide est réalisé au moyen d'une pluralité de blocs laminés ayant chacun une pluralité de couches de câblage et de couches isolantes interlaminées en polyimide. Sur un bloc de base ayant un subjectile, les autres blocs sont déposés les uns par-dessus les autres, liaisonnés les uns aux autres à l'aide de polyimide utilisée dans chaque bloc, ou un autre adhésif, et reliés électriquement les uns aux autres au moyen, par exemple, de bossages métalliques formés sur chaque bloc. Chacun des blocs, sauf le bloc de base, est formé sur un subjectile temporaire et le subjectile temporaire est retiré après liaisonnement de chaque bloc au bloc de base ou aux blocs précédemment liaisonnés. Le tableau de connexion multicouche peut être effectué dans un délai réduit avec un rendement accru.

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