Adhesion promoting additives and low temperature curing...

Details Adhesion promoting additives and low temperature curing... Adhesion promoting additives and low temperature curing...

Category

C - Chemistry, Metallurgy

Subcategory

07

Subsubcategory

F

IPC codes

C07F 7/18 (2006.01) C08G 77/18 (2006.01) C08G 77/20 (2006.01) C08L 83/04 (2006.01) C09J 11/06 (2006.01) C09J 183/04 (2006.01) H05K 3/28 (2006.01)

Type

Patent

Patent number

CA 2130134

Description

ADHESION PROMOTING ADDITIVES AND LOW TEMPERATURE CURING ORGANOSILOXANE COMPOSITIONS CONTAINING SAME ABSTRACT Adhesion promoting additives for organosiloxane compositions that cure by a platinum-catalyzed hydrosilation reaction are reaction products of (1) an ethylenically unsaturated ether of a polyfunctional alcohol and (2) at least one silicon compound selected from (i) epoxy- substituted organosilicon compounds containing at least one hydrolyzable group per molecule and (ii) tetraalkyl ortho- silicates, also referred to tetraalkoxysilanes, where the reaction is conducted in the presence of a suitable catalyst such as an organotitanium compound. The additive optionally includes a chelated organoaluminum compound.

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