Method for constructing an optoelectronic assembly

Details Method for constructing an optoelectronic assembly Method for constructing an optoelectronic assembly

G - Physics

02

B

G02B 6/13 (2006.01) G02B 6/42 (2006.01)

Patent

CA 2358529

A package (10) for optical components (16, 18, 22) and a method for making the package are disclosed. The package (10) comprises a quasi-planar substrate (12) having a positioning floor (14), a platform (20), and an optional ring frame (32) of precisely determined height, upon which structures the optical components (16, 18, 22) are picked and placed. A flexure assembly (24) allows fine positioning of components (16, 18, 22) which require critical optical alignment.

L'invention concerne un boîtier (10) pour composants optiques (16, 18, 22) et un procédé pour fabriquer ledit boîtier. Le boîtier (10) comprend un substrat quasi plan (12) comportant un étage de positionnement (14), une plate-forme (20) et éventuellement un cadre annulaire (32) ayant une hauteur déterminée avec précision. Les composants optiques (16, 18, 22) sont saisis et placés sur un étage de substrat, une plate-forme surélevée et un cadre. Un assemblage à élément souple (24) permet de positionner avec précision les composants (16, 18, 22) nécessitant un alignement optique très précis.

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