H - Electricity – 03 – H
Patent
H - Electricity
03
H
H03H 9/05 (2006.01) H01L 23/552 (2006.01) H03H 3/08 (2006.01) H03H 9/10 (2006.01) H03H 9/25 (2006.01)
Patent
CA 2321473
In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface-wave chips 1 by a flip-chip technique. A metal or plastic foil 3 or 4 is then laid on the carrier plate 10 fitted with chips and then processed under heat and pressure, for example, so that each chip 1 - except for the chip surface facing the carrier plate 10 - is enveloped and hermetically sealed on the carrier plate surface in the zones between the chips.
L'invention concerne un procédé de production d'un filtre à ondes de surface, selon lequel une plaque de support (10) pouvant être divisée en plaques de base (2) est pourvue dans chaque zone de plaque de base (A) de pistes conductrices qui sont mises en contact, selon la technique de la connexion par billes, avec les structures actives de puces à ondes de surface, un film de métal ou de matière plastique (3 ou 4) étant ensuite appliqué sur la plaque de support (10) équipée de puces et, par exemple, traité à la vapeur ou thermiquement de telle sorte qu'il enveloppe chaque puce (1), exceptée la surface de puce tournée vers la plaque de support (10), et qu'il repose, dans les zones comprises entre les puces, de façon hermétique sur la surface de la plaque de support.
Demmer Peter
Kruger Hans
Stelzl Alois
Epcos Ag
Fetherstonhaugh & Co.
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