Plasma processing apparatus and method

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 21/3065 (2006.01) C23C 16/509 (2006.01) H01J 37/32 (2006.01)

Patent

CA 2517133

A nozzle head (NH) of a plasma processing apparatus comprises a ring-shaped inner holder (3), a ring-shaped inner electrode (11) surrounding the inner holder (3), a ring-shaped outer electrode (21) surrounding the inner electrode (11), and a ring-shaped outer holder (4) surrounding the outer electrode (21). The inner holder (3) is provided with a plurality of bolts (7) which are arranged circumferentially with intervals for pressing the inner electrode (11) diametrically outward. The outer holder (4) is provided with a plurality of bolts (8) which are arranged circumferentially with intervals for pressing the outer electrode (21) diametrically inward. With this structure, demounting, mounting and centering of the ring-shaped electrodes (11, 21) can be done easily.

Selon la présente invention, une tête de buse (NH) d'un appareil de traitement au plasma comprend un support interne annulaire (3), une électrode interne annulaire (11) qui entoure ledit support interne (3), une électrode externe annulaire (21) qui entoure ladite électrode interne (11), ainsi qu'un support externe annulaire (4) qui entoure ladite électrode externe (21). Le support interne (3) présente une pluralité de boulons (7) qui sont placés à la circonférence à certains intervalles et qui permettent de comprimer l'électrode interne (11) diamétralement vers l'extérieur. Le support externe (4) présente une pluralité de boulons (8) qui sont placés à la circonférence à certains intervalles et qui permettent de comprimer l'électrode externe (21) diamétralement vers l'intérieur. Cette structure permet de démonter, de monter et de centrer facilement les électrodes annulaires (11, 21).

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Plasma processing apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma processing apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing apparatus and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1858787

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.